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Thermal Analysis of Sintered Silver Nanoparticles Film | ||
| Challenges in Nano and Micro Scale Science and Technology | ||
| مقاله 2، دوره 2، شماره 2، مهر 2014، صفحه 100-107 اصل مقاله (2.83 M) | ||
| نوع مقاله: Original Research Paper | ||
| شناسه دیجیتال (DOI): 10.7508/tpnms.2014.02.002 | ||
| نویسندگان | ||
| M. Keikhaie* 1؛ M.R. Movahhedi1؛ J. Akbari1، 2؛ H. Alemohammad1، 3 | ||
| 1Mechanical Engineering Department, University of Sharif, Tehran, I.R. Iran | ||
| 2Engineering Design and Manufacture Department, University of Malaya, Kuala Lumpur, Malaysia | ||
| 3Mechanical and Mechatronics Engineering Department, University of Waterloo, Waterloo, Canada | ||
| چکیده | ||
| Thin bonded films have many applications in antireflection and reflection coating, insulating and conducting films and semiconductor industries. Thermal conductivity is one of the most important parameter for power packaging since the thermal resistance of the interconnections is directly related to the heat removal capability and thermal management of the power package. The defects in materials play very important role on the effective thermal conductivity. In this paper, finite element method (FEM) was utilized to simulate the effect of pores on the effective thermal conductivity of sintered silver nanoparticles film. The simulation results indicate that the effective thermal conductivity of film is different at different directions and would be enhanced when the pore angle is 90. The simulation results will help us to further understand the heat transfer process across highly porous structures and will provide us a powerful guide to design coating with high thermal insulation or conductor property. Because of there is no similar experimental data for this simulation results, this paper is a comparative work among three different models. | ||
| کلیدواژه‌ها | ||
| Thin film Propylene glycol؛ Silver nanoparticles؛ thermal conductivity؛ Heat flux | ||
| مراجع | ||
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[9] M. Keikhaie, J. Akbari, M.R. Movahhedi, H.R. Alemohammad, Sintering Characterizations of Ag-nano Film on Silicon Substrate, Advanced Materials Research 829 (2014) 342-346.
[10] Y. Mei, G. Chen, G. Lu, X. Chen, Effect of joint sizes of low-temperature sintered nano-silver on thermal residual curvature of sandwiched assembly, International Journal of Adhesion & Adhesives 35 (2012) 88–93.
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آمار تعداد مشاهده مقاله: 2,466 تعداد دریافت فایل اصل مقاله: 1,943 |
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